Advanced Microsystems for Automotive Applications 2000 by E. Mounier, S. Leroy, M. Waga (auth.), Dr. Sven Krüger,

By E. Mounier, S. Leroy, M. Waga (auth.), Dr. Sven Krüger, Wolfgang Gessner (eds.)

Microsystems are a massive good fortune think about the auto undefined. as a way to fulfil the purchasers' requests for protection comfort and car financial system, and to fulfill environmental standards, microsystems have gotten integral. hence a great number of microsystem functions got here into the dialogue. With the foreign convention AMAA 2000, VDI/VDE-IT presents a platform for the dialogue of all MST proper elements for car purposes. The convention court cases assemble the papers through authors from car providers and manufacturers.

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This result shows that a sharp interface exists between metal and insulator films wit h the thickness of 50 nm . 25 nm show uniform phas e distri bution . A similar result has been obta ined fo r the Pd/SiO z stack. Thus our suggestion that the SiO z phase fo rmation occu rs between Pt and Pd clusters is confirmed by TEM and A uge r examina tions . Development of Highly Active Catalyst a) b) Fig. a6/b. V. M. E. Soltis et al. a) liS PIICfIl£ ~If I\C1. 5OKTH. 1. f1j [: RE. 1'$ ~IH. ' l' Fi g . 25 nm b) Development of Highly Active Cata lyst 4 37 Conclusion Itis probable that the enha ncem ent effect for the investigated systems should be connected with existence of two different materia l mixt ure having nanometer grain size.

This is achieved by programming the integrated low pow er fuses. Calibr ation at the end of the production proces s is the most important factor in attaining high accur acy. 44 V. Gussmann 3 Package Th e need of a low cost solution lead to the development of a plastic SMDpackage: P-DSOF-8: this 8 pin package is open at the top. After die- and wirebondin g , the chip is covered with a protective silicon gel. Thi s gel transmits the surrounding pressur e to the active sensor cells on the die . Th e fully assemb led part s, each with a protectiv e cap , are delivered in Tap e--Reel for easy and safe moun ting (see photo of package / Fig .

In the tools, system design ers create a mixed technology schematic using build ing blocks. Each of these bricks encapsulates a behav iour al model , w ritten in HDL- A S. Krüger et al. A. Maher, A. Delpoux, K. Liateni et al. o r in VHDL-AMS . Full sys tem fu nctionality ca n be ve rified , through a mult ilevel , mixed- mode , multi-domain behavioural sim ulation : Th e sys tem ca n be a MEMS co mpo nent or a full sys tem incl uding the read -ou t electro nics, whether it is integra ted monolithically o r in a hyb rid assembly.

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